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GE Sensing

Inspection & NDT
 
Dalla più avanzata tecnologia di raccolta dati al software innovativo che permette la collaborazione a distanza, GE fornisce una gamma completa di soluzioni e attrezzature (NDT) tra cui la radiografia, tomografia computerizzata, ispexioni visiva remota, ultrasuoni.

phoenix nanome|x

phoenix nanome|x

The phoenix nanome|x is an ultra high-resolution nanofocus X-ray inspection system designed for inspecting high-quality assemblies and interconnections in the semiconductor and SMT industries. The system offers excellent performance and versatility and can be optionally used for 2D X-ray inspection as well as for full 3D computed tomography (micro- and nanoCT as well as planarCT). With the phoenix x|act software package the phoenix nanome|x is the system of choice to ensure meeting actual and future zero defect requirements.  

Features and Benefits

Customer Benefits: 

  • Combined 2D / 3D CT operation
  • Superior dual detector technology (digital image chain and active temperature-stabilized digital detector with 30 fps) for brilliant live images
  • Automation of inspection steps possible
  • Outstanding ease-of-use
Key Features: 
  • High magnification
  • Precise Manipulation
  • High repeatability
  • 180 kV / 15 W high-power open nanofocus tube with up to 200 nanometer detail detectability
  • Upgradeable to nanoCT® and / or planarCT 
Optional: 
  • phoenix x|act software package for easy and fast CAD based high-resolution automated X-ray inspection (μAXI) for extremely high defect coverage with high magnification and repeatability
  • Brilliant live inspection images due to high dynamic temperature-stabilized digital GE DXR detector with 30 fps (frames per second) and active cooling
  • 3D computed tomography scans within 10 seconds
  • Up to 2 times faster data acquisition at the same high image quality level by diamond|window

phoenix x|aminer

phoenix x|aminer

The phoenix x|aminer is an easy to use entry-level non-destructive testing (NDT) X-ray inspection system with strong performance that is designed for the special needs of the high-resolution inspection of electronic assemblies, components and PCBA. Due to the new combination of CMOS flat panel detector and computed tomography (CT) the system provides significant better signal-to-noise-ratio, sharpness and life-imaging capability compared to image intensifier based CT. The powerful phoenix x|act base software for 2D and phoenix datos|x base for CT offers ease of use and allows manual as well as automatic inspection.

KEY FEATURES & BENEFITS
  • Unlimited lifetime 160 kV / 20 W X-ray tube to penetrate even high absorbing components
  • Improved live inspection capability due to high contrast CMOS flat panel detector option
  • Easy and fast computed tomography (CT) due to comprehensive software package
  • Intuitive operation and easy to use software
  • Live CAD data overlay
  • Automated real X-ray sample map for easy orientation on top, bottom and even inside samples
  • Anti-collision feature to protect samples
  • Small footprint
  • ETL certified in accordance with UL / CSA 61010-1 and 61010-2-091

phoenix microme|x - X-ray Inspection System

phoenix microme|x - X-ray Inspection System

The phoenix microme|x is a high-resolution 180 kV microfocus X-ray inspection system for real time inspection of solder joints and electronic components as well as for automated inspection (µAXI). Innovative and unique features and an extreme high positioning accuracy make the system the effective and reliable solution for a wide spectrum of 2D and 3D inspection tasks: R&D, failure analysis, process and quality control as well as automated offline inspection. Optional the system can be equipped with CT or planarCT.

Features and Benefits

 
CUSTOMER BENEFITS 
  • Extremely high defect coverage and repeatability
  • Outstanding ease-of-use
  • Up to 2 times faster data acquisition at the same high image quality level by diamond|window as a new standard
  • Combined 2D / 3D CT operation
KEY FEATURES 
  • 180 kV / 20 W high-power microfocus tube with up to 0,5 µm detail detectability
  • Brilliant live images by high dynamic temperature-stabilized GE DXR digital detector with 30 fps (frames per second)
  • x|act software package for easy and fast CAD based high-resolution automated X-ray inspection (μAXI) for extremely high defect coverage with high magnification and repeatability
  • Precise manipulation
  • 3D computed tomography scans within 10 seconds (optional)
  • Advanced planarCT option for slice or multislice package evaluation without overaying structures